New FIDES-CARE software

Features

· Calculates MTBF directly from the schematic-parts-list (BOM)

· Provide MTBF for each component, each PCB and for the entire system

· Can calculate multiple PCB′s in hierarchic structure

· Provide a graph showing the MTBF versus temperature (Fig. 4)

· Perform a stress derating (smoke alarm) for all component types

· Ready to use 3 derating standards and user define derating curves for all components types (Fig.3)

· Recommends the correct rating values to eliminate over-stress and over-design components (Fig.2)

· Provide a quick thermal analysis report

· Provide the Junction temperature for each semiconductor

· Ready interface to all popular EDA tools

· All MTBF prediction models are integrated in the MTBF-CARE (Table 1)

· Includes database and editor to mange components reliability properties

· Provides on screen and XML Pareto reports to quickly identify the unreliable components (Fig.5)

· Provide 6 different ready to use reports which can be customized

· User can create many operational / non-operational profiles to simulate real operation

· Can use SPICE and fiXtress stress for more realistic results