The FIDES methodology covers items from elementary electronic components to electronic modules or subassemblies with well-defined functions.
The FIDES coverage of component families is not fully exhaustive. However, it is sufficient to allow a representative assessment of the reliability in almost all cases.
The methodology applies to COTS (for which it was originally developed) and also to specific items whose technical characteristics match those described in this guide.
The COTS (Commercial Off-The-Shelf) acronym designates all catalog-bought items, available on the domestic or foreign market, with a supplier P/N, and for which the customer has no input on the definition or production. This item may be modified, its production or maintenance stopped with no possible opposition from the customer. There may be only one or several suppliers for each item.
Components
FIDES covers the following components:
INTEGRATED CIRCUITS
MOS (silicon) digital, linear, mixed
MOS memory: SRAM, DRAM, Flash EEPROM, EEPROM, EPROM,
MOS programmable circuits (Silicon): CPLD, FPGA
Bipolar circuits (silicon): LV mixed, linear
BICMOS circuits (silicon): LV mixed
DISCRETE SEMICONDUCTORS
Low power diodes (diodes with signal up to 1 A: PIN, Schottky, signal; rectifier diodes 1 to 3 A; Zener
diodes < 1.5 W)
Power diode (Rectifier diodes > 3A; Protection diodes > 5 kW; Thyristors, triacs > 3 A)
Si low-power transistors (Bipolar, JFET, MOS) < 1W
Si power transistors (Bipolar, JFET, MOS) > 1W; IGBT
Optocouplers
CAPACITORS AND THERMISTORS (CTN)
Ceramic capacitors type I and II
Solid tantalum capacitors
Wet tantalum capacitor
Aluminum capacitors (liquid electrolyte)
Aluminum capacitors (solid electrolyte)
RESISTORS AND POTENTIOMETERS
"Minimelf" common use (RC) high stability (RS) low power film resistor
Power film resistor
Low power wirewound precision resistor
Power wirewound resistor
Resistive chips
CERMET adjustment potentiometer
INDUCTORS AND TRANSFORMERS
Low current wirewound inductors
High current (or power) wirewound inductors
Multi-layer ceramic chip inductor
Low power (or low level) transformer
High power transformer
RELAYS
Hermetically sealed electromechanical relays
PCB and CONNECTORS
PCB
Connectors
PIEZOELECTRIC PARTS
Resonators
Crystal quartz oscillators
In the next guide release (2008), FIDES will cover the following components :
INTEGRATED CIRCUITS
ASIC
AsGa based components
SiGe based components
DISCRETE SEMICONDUCTORS
Optoelectronic converters : LED
Optoelectronic converters : laser diodes
Protection diodes (transorb) < 5 KW
RESISTORS AND POTENTIOMETERS
Bulk metal foil resistors
Conductive plastic element precision potentiometers
Other components
Fuses
Hybrids and Multi Chip Modules
Passive Devices : filters
Fans
DC/DC Voltage Converters
Power Supply Modules
Energy Storage Modules (batteries)
PC Sub-assemblies : CD-ROM, DVD-ROM, burner
Keyboards
Pressure sensors
Hyper frequency Modules (board method)
LCD
PWAs
The wired board model serves to make a macroscopic reliability evaluation of a board without having recourse to component, PCB and connector models. It is intended on the one hand for COTS boards and on the other, for the early phases of a project, two situations in which the elements of detailed definition (parts lists, electrical diagrams, etc.) are not available.
For this approach, given the integration and constant technological progress of electrical components, a classification by board electronic technical function has been used, rather than by PWA devoted to a function. Thus each board is broken down into a sum of electronic functions.
The electronic functions covered are divided into 3 main families:
Digital electronic functions, comprising:
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CPU function.
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Simple or complex logic function.
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Volatile and non-volatile memory function.
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Clock function.
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Power supply monitoring function.
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Extension Bus interface function (buffer).
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Level adaptation function (line drivers): RS422, RS232, etc.
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Galvanic isolation function (optocoupling).
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Transistor switching function (outputs).
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Specific protocol interface function (transceiver + controller): PCI, ETHERNET,
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ADC, LON, 1553, ARINC, DIGIBUS, etc.
Analog electronic functions, comprising:
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Analog-to-digital and digital-to-analog conversion functions.
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Transmission/reception, amplification, summing, integration, filtering functions.
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Relay switching function.
Electronic power functions, comprising:
Miscellaneous Subassemblies
FIDES also covers the following other subassemblies:
Remark: Families in italics and marked with an asterisk (*) shall be addressed subsequently.
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